Recommendation: Key Issues in SiC Power Module Packaging Technology and Prospects for Advanced Technology
Recommended by the Semiconductor Industry Network: The integration, high frequency and high efficiency requirements of SiCMOSFET devices have put forward higher requirements for the packaging form and process of power modules. This paper summarizes the structural optimization and technological innovation of packaging forms in recent years, including the influence of the length, width and parallel number of metal bonding wires of bonded power
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